Chapter 1
Microfabrication Techniques for Microfluidic Devices

1.1		Introduction to microsystems and microfluidic devices
1.2		Microfluidic systems: fabrication techniques
1.3		Transfer processes
1.3.1		Photolithography
1.3.2		Molding
1.4.		Additive processes
1.4.1		Growth of SiO2
1.4.2		Deposition techniques
1.5.		Subtractive Techniques
1.5.1		Etching
1.5.2		Chemical-mechanical polishing and planarization
1.6.		Bonding Processes
1.6.1		Lamination
1.6.2		Wafer bonding methods
1.7.		Sacrificial layer techniques
1.8.		Packaging Processes
1.8.1		Dicing
1.8.2		Electrical interconnection and wire bonding
1.8.3		Fluidic interconnection in microfluidic systems
1.9.		Materials for microfluidic and bio-MEMS applications
1.9.1		Glass, pyrex, and quartz
1.9.2		Silicon
1.9.3		Elastomers
1.9.4		Polydimethylsiloxane
1.9.5		Epoxy
1.9.6		SU-8 thick resists
1.9.7		Thick positive resists
1.9.8		Benzocyclobutene
1.9.9		Polyimides
1.9.10		Polycarbonate
1.9.11		Polytetrafluoroethylene
1.10.		Troubleshooting Table
1.11.		Summary, References

Chapter 2
Micropumping and Microvalving

2.1.		Introduction
2.2.		Actuators for micropumps and microvalves
2.2.1.		Pneumatic actuators
2.2.2		Thermopneumatic actuators
2.2.3.		Solid-expansion actuators
2.2.4		Bimetallic actuators
2.2.5		Shape-memory alloy actuators
2.2.6		Piezoelectric actuators
2.2.7		Electrostatic actuators
2.2.8		Electromagnetic actuators
2.2.9		Electrochemical actuators
2.2.10		Chemical actuators
2.2.11		Capillary-force actuators
2.3.		Micropumps
2.3.1		Mechanical pump
2.3.2		Nonmechanical pump
2.4		Microvalves
2.4.1		Mechanical valve
2.4.2		Nonmechanical valve
2.5.		Outlook
2.6		Troubleshooting
2.7		Summary points, References

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